iPhone 7 Plus Sets High Clock Speed Record in Geekbench


Well according to latest reports upcoming Apple flasgship device iPhone 7 Plus has ostensibly set the highest clock speed record in Greekbench meter. Apple’s iPhone 7 Plus has shattered all previous clock speed records in the benchmark’s history as was anticipated by the majority of tech industry experts. iPhone 7 Plus Greekbench clock speed score being reported is abnormally high and hard to believe.

Apple iPhone 7 Plus sets Greekbench Record for both Single and Multi-Core Scores – RAM Upgrade and High Clock Speed

This record score become even more unbelievable considering the processing slotted inside the iPhone 7 Plus has only two cores. Main things that helped iPhone 7 Plus to set processor speed record despite having only two cores are its CPU compatible design and Apple’s own designed architecture and iOS compatibility.

One more thing that early leaks have indicated is that the new phablet device might come with 3GB RAM that is a lot compared to Apple’s usual standards. This memory upgrade is surely to help graphics intensive games and apps.


New processor on iPhone 7 devices called A10 is based on TSMC’s 15nm FinFET technology, which boasts same nodes that are going to be used in the upcoming Apple Watch 2. Also it has been all but confirmed that the new iPhone 7 models would come packed with A10 SoC. Earler performance results of this processor left a lot to be desired but this latest Geekbench score has cleared all doubts anyone might have had about the performance of iPhone 7 Plus processors.

iPhone 7 Plus phablet is expected to have a 3,100mAh battery which is a huge jump for any Apple iOS device. LTE modem of the phablet is being prepared by two separate manufacturers. Also, we are told that the internal storage is 256GB apart from 128GB standard memory, which would be a welcome storage upgrade since it is going to be mainly a multimedia device.


Apple has also shifted to a new chip designing technology known as FoWLP (Fan-out Water Level Packaging Platform). This technology can serve to reduce the thickness of the mobile device as FoWLP doesn’t need a PCB to support it. This new technology would also enhance the chipset efficiency to almost thirty percent with accompanying reduction in thickness of about 0.3mm. And you can be certain that Apple is going to highlight device’s slimness often during its iPhone 7 launch keynote in September.

What do think about Apple’s Greekbench score achievement? Let us know in the comments section.

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